For etching of Cu seed layers of Cu plating and Cu seed structures with little damage to lines and bumps formed by Cu plating.
Etching performance varies with the film-forming technique employed and the specific film structure. Contact us for more information.

Keywords: wet etching, copper, plating, seed layer, selective semi-additive process

Features

• Less impact on Cu plating
• Less surface roughness on Cu
• Usable with a variety of Cu seed layers(Electroless Cu plating, Sputtering)
• Accommodates a variety of processes, including dipping, spraying, and spinning