For etching of Cu seed layers of Cu plating and Cu seed structures with little damage to Cu-plated wires and bumps.

Keywords: wet etching, copper, plating, seed layer, selective semi-additive process

Features

• Less impact on Cu plating
• Less surface roughness on Cu
• Can be used to etch any Cu seed layer. (Electroless Cu plating, Sputtering)
• Accommodates a variety of processes, including dipping, spraying, and spinning.